MTS - Adv Pkg TD Integrator
Core
Developing advanced packaging process solutions to ensure success for new processes, equipment, materials, and pathfinding activities for all advanced packaging products.
Role type
Senior IC process technology integrator (advanced packaging)
Builds
New Technode process readiness, yield, quality, and reliability improvements for DRAM/NAND memory and storage products
Domain
Semiconductor manufacturing (backend advanced packaging)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
failure analysis methodologies, DRAM/NAND technology expertise, frontend fab process integration, backend advanced packaging wafer/die level process, temporary/permanent bonding technology, silicon integration and CPI understanding, simulation tools and data analytics platforms, project management
Preferred skills
technical journals or patents publication, creative solution development for process constraints
Technologies
simulation tools, data analytics platforms
Responsibilities
Develop and qualify new packaging process, material, equipment, and technology solutions; Perform CPI NUDD, process TRA, risk mitigation, and recipe readiness; Qualify new process/technology/equipment/materials; Identify pathfinding opportunities for technology leadership and yield improvement; Integrate process knowledge between upstream and downstream across Si and assembly/packaging; Define, develop, and establish process capabilities, strategy, and roadmap
Seniority
Senior, hands-on IC
