Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering
Core
Lead a high-performing team to drive Package and HBM Product engineering activities, focusing on Quality, Cost, Cycle Time, and Scale for next-generation Heterogeneous Memory solutions.
Role type
Senior Product Engineering Manager (Heterogeneous Integration)
Builds
High Bandwidth Memory (HBM) products and systems
Domain
Semiconductor manufacturing and packaging
Deliverable
production ML models | product features
Required skills
Device characterization, root cause analysis (EFA/PFA), circuit analysis, statistics, data analysis, Python, C, team leadership, project management, technical decision making
Preferred skills
AI/ML model development and deployment
Technologies
Python, C, EFA, PFA
Responsibilities
Improve ASM yield and DPM, optimize HBM Cube yield, manage cumulative yield ownership, debug packaging failures, establish process conversion business processes, mentor team members, collaborate cross-functionally, promote innovation, manage projects, make technical decisions
Seniority
Senior, hands-on IC with team leadership