Principal Customer Integration Engineer, Product & Process Engineering (HBM)
Core
Enable successful integration of advanced High Bandwidth Memory (HBM) products into customer systems through hands-on technical problem-solving across product development, system architecture, and manufacturing processes.
Role type
Principal Customer Integration Engineer (HBM)
Builds
Advanced HBM memory and storage solutions
Domain
Semiconductor industry, High Bandwidth Memory (HBM) packaging and system integration
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Deep technical knowledge in product engineering, system engineering, front-end/back-end process, Package Failure Analysis (PFA), qualification, or test; Hands-on experience in semiconductor manufacturing and system build; Ability to collaborate with multi-functional groups; Strong analytical and problem-solving abilities
Preferred skills
Cross-training expertise beyond primary subject area; Knowledge of HBM architecture and packaging technologies; Effective communication for technical updates and documentation
Technologies
HBM architecture, packaging technologies, semiconductor manufacturing processes
Responsibilities
Apply deep technical knowledge across product engineering, system engineering, build, front-end/back-end process, PFA, qualification, or test; Support integration of customer requirements into internal design and manufacturing processes; Participate in technical reviews, debug sessions, and failure analysis activities; Work closely with internal teams to resolve technical challenges; Assist in yield improvement and qualification efforts tied to customer programs
Seniority
Principal, hands-on IC with strategic customer engagement