Snr/Staff Equipment Development Engineer (APTD)
Core
Develop and optimize advanced packaging equipment (wafer-level packaging, stacking, bonding) to enable semiconductor manufacturing processes and improve productivity.
Role type
Senior/Staff Equipment Development Engineer (Semiconductor Packaging)
Builds
Advanced packaging equipment and hardware roadmaps for post-probe wafer and die processing
Domain
Semiconductor manufacturing / Equipment engineering
Deliverable
production ML models | product features | infrastructure
Required skills
Semiconductor process engineering, equipment development (FOAK), wafer bonding, plating, warpage control, process modeling, root cause analysis, hardware roadmap planning, cross-functional team leadership
Preferred skills
Python, R, SQL, Visual Basic, E3, FDC, RMS, MES, SPC, DOE, defect analysis, solid-state device physics
Technologies
Python, R, SQL, Visual Basic, E3, FDC, RMS, MES, Autoshell
Responsibilities
Develop and optimize advanced packaging equipment; Establish hardware strategic roadmaps for 5+ years; Lead transition from NPD to high-volume production; Collaborate with process and engineering teams; Conduct continuous data analysis for advanced controls; Perform fundamental research for next-gen equipment
Seniority
Senior/Staff, hands-on IC with strategic planning
