塑封设备工程师/Molding Equipment Engineer
Core
Operate, maintain, and optimize molding equipment and automated production lines for semiconductor packaging.
Role type
Molding Equipment Engineer
Builds
Semiconductor packaging products
Domain
Semiconductor manufacturing / Equipment engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging process knowledge, OEE data analysis, equipment troubleshooting, 8D reporting, yield optimization, cross-functional collaboration, cleanroom compliance, project management
Preferred skills
Mechanical automation, measurement and control engineering, material engineering, microelectronics, electronic information
Technologies
Molding presses, automated production lines, office software
Responsibilities
Daily operation and fault repair of molding equipment, develop equipment procurement specifications, manage spare parts and mold ledgers, coordinate with suppliers for maintenance and upgrades, support new product trials and parameter tuning
Seniority
Mid-level, hands-on IC