Engineer, APTD CEM - Advanced Packaging Equipment Engineering
Core
Develop and optimize advanced packaging equipment for wafer-level packaging and stacking to enable process improvements and productivity gains.
Role type
Senior IC equipment development engineer (semiconductor packaging)
Builds
Advanced packaging equipment and hardware strategic roadmaps for post probe wafer and die processing
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | infrastructure
Required skills
Analytical thinking, critical thinking, process modeling, data analytics, automation scripting
Preferred skills
Statistical analysis, Python, R, SQL, Visual Basic, semiconductor industry knowledge
Technologies
Python, R, SQL, Visual Basic
Responsibilities
Develop and optimize advanced packaging equipment; Establish hardware strategic roadmaps for 5+ years; Ensure defense coverage through process and testing; Collaborate with cross-functional teams to integrate manufacturing processes
Seniority
Senior, hands-on IC
