Wafer Bond Process Development Engineer
Core
Developing and sustaining wafer bonding process technology to meet DRAM roadmap requirements for memory and storage solutions.
Role type
Process Development Engineer (Wafer Bonding)
Builds
Wafer bonding processes for DRAM and memory products
Domain
Semiconductor manufacturing / Memory technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wafer bonding process development, Process integration, Equipment optimization, SPC principles, Recipe management, Model-based problem solving
Preferred skills
Photolithography, Wet process, Thin films, Wafer thinning (grind and CMP), Cross-functional team leadership
Technologies
CMP, Grind equipment, SPC tools
Responsibilities
Own new process development and sustain current processes, Collaborate with equipment and integration teams to develop solutions, Optimize processes to reduce cost and variability
Seniority
Mid-Senior, hands-on IC
