Advance Packaging Process Development Engineer
Core
Developing, configuring, and optimizing package assembly processes (front end, bonding, back end) for memory product ramp-up, including side-by-side certification with manufacturing teams.
Role type
Junior IC process development engineer (semiconductor packaging)
Builds
Memory products (DRAM, NAND, NOR) and innovative package technologies (HBM, TSV, Bumping)
Domain
Semiconductor manufacturing and packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Process development, data interpretation, measurement analysis, change control board (CCB) management, process capability assessment, integration experience in package assembly and wafer level processes
Preferred skills
Experience with High Bandwidth Memory (HBM) integration, TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), Ball Mount, Photo, PVD, CVD, wafer level molding, Flip Chip, Underfill, Hybrid bond, Glass carrier bond/de-bond
Technologies
TCB, CMP, Ball Mount, Photo, PVD, CVD, wafer level molding, Flip Chip, Underfill, Hybrid bond, Glass carrier
Responsibilities
Develop and optimize package assembly processes, assess processes by knowledge and skills, take measurements and interpret data, run, test, and upgrade systems and processes, approve material and equipment changes in CCB
Seniority
Junior, fresh graduate to <2 years experience
