Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Manufacturing)
Core
Lead manufacturing test flow development, validation, and yield improvement for High Bandwidth Memory (HBM) products across DRAM, Interface, and Stacked Die architectures.
Role type
Principal Engineer / Member of Technical Staff (MTS) – HBM Product System Engineering
Builds
Next-generation HBM products for data center and AI applications
Domain
Semiconductor manufacturing, High Bandwidth Memory (HBM), DRAM, Interface, and Stacked Die
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
circuit analysis, root cause analysis, test coverage optimization, yield improvement, DFT strategy, statistics, data analysis, scripting, project management, technical decision making
Preferred skills
Product Engineering experience, cross-functional collaboration, mentorship
Technologies
CAD tools, Verilog simulations
Responsibilities
Ensure optimized test coverage on current and future HIG HBM design architectures; Develop, validate, characterize, and qualify next-generation HBM products; Support design verification and in-depth circuit analysis for new products; Improve manufacturing test yields and reduce test time; Resolve yield-related issues and manufacturing test flow problems; Promote innovation to maintain competitive advantage; Mentor team members; Make final decisions on risk analysis and project prioritization; Collaborate with Fab, Design, Test, and Quality teams.
Seniority
Principal, hands-on IC with leadership responsibilities