Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Manufacturing)
Core
Lead a high-performing team driving Media Health Manufacturing and activities for Micron's latest High Bandwidth Memory (HBM) products, focusing on Quality, Cost, Cycle Time, and Scale.
Role type
Principal Engineer / Member of Technical Staff (MTS)
Builds
Next-generation HBM products (DRAM, Interface die, and stacked products)
Domain
Semiconductor manufacturing and High Bandwidth Memory (HBM)
Required skills
Circuit analysis, root cause analysis, test flow development, yield improvement, DFT strategy, cross-functional collaboration, project management, technical decision making
Preferred skills
Product engineering experience, statistics and data analysis, scripting
Technologies
CAD tools, Verilog simulations
Responsibilities
Optimize test coverage for HBM design architectures; develop, validate, and qualify next-generation HBM products; support new product design verification using CAD and Verilog; improve manufacturing test yields and reduce test time; resolve manufacturing test flow and RMA device issues; promote innovation in manufacturing processes; mentor and develop team members; manage projects and make technical decisions; collaborate with cross-functional teams (Fab, Design, Test, Quality).
Seniority
Principal, hands-on IC with leadership responsibilities