Dry Etch MTS/Principal Engineer, Process Development SG, Advanced NAND
Core
Leading innovation in dry etch technology and essential module advancement for Next Generation NAND products.
Role type
Principal Engineer / Member of Technical Staff (MTS) in Process Development
Builds
Next Generation NAND memory modules (HAR, Tier by tier etches, WL contacts & staircase)
Domain
Semiconductor manufacturing, specifically NAND flash memory process development
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
dry etch process development, plasma physics, plasma chemistry, statistical process control, problem-solving, technical project management, cross-functional collaboration, supplier negotiation, deep high aspect ratio silicon/dielectric etches, tailored pulsing schemes
Preferred skills
data science basics, Python coding, AI tools, MS Office, SAS software (JmP)
Technologies
RF sources, dry etch reactors, SAS (JmP), Python
Responsibilities
Develop and innovate dry etch processes to meet structural and electrical specifications; Work with hardware teams to develop equipment roadmaps; Collaborate and lead cross-functional teams to solve complex structural problems; Present process and technology roadmaps; Proactively predict and mitigate future issues; Mentor less experienced engineers; Lead supplier head-to-heads
Seniority
Senior, hands-on IC with mentorship responsibilities