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Engineer, Package Health Engineering

Fab 10A, Singapore💼 Full-time🗓 2025-10-17 → 2026-07-31

Core

Develop and execute package health monitoring, simulation, and characterization activities to ensure robust semiconductor packaging solutions.

Role type

Package Health Engineer (DFT & Reliability)

Builds

Advanced packaging solutions for memory and storage products

Domain

Semiconductor manufacturing and reliability engineering

Deliverable

production ML models | product features | dashboards & analysis

Required skills

DFT strategy development, mechanical/thermal/electrical simulation, package characterization, data analysis, root cause analysis, predictive modeling, scripting (Python/MATLAB), simulation tools operation

Preferred skills

AI/ML tools, statistical modeling, JEDEC standards, Visual Basic automation, semiconductor industry experience

Technologies

Python, MATLAB, Visual Basic, simulation tools, test equipment

Responsibilities

Develop DFT strategies for advanced packaging, conduct performance simulations, characterize packages electrically and mechanically, analyze test/field data for degradation, collaborate on predictive models, support root cause analysis

Seniority

Individual Contributor, mid-level

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