SR. HBM EQUIPMENT ENGINEER
Core
Diagnose and resolve assembly equipment problems for high-bandwidth memory (HBM) manufacturing processes including flip chip, wafer molding, grinding, and dicing.
Role type
Senior IC equipment engineer (HBM assembly)
Builds
HBM memory modules and storage solutions
Domain
Semiconductor manufacturing / Memory and storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
HBM assembly equipment operation, process optimization, supplier quality management, FDC/RMS/APC/SPC support, cross-divisional communication
Preferred skills
Experience with NCF lamination, site-to-site portability, cost reduction initiatives
Technologies
Flip chip, CoWos, Wafer inspect, Wafer Molding, Grinding, PSRG, Thinning, Mount, Pillar Reflow, Debond, Steal dicing, laser groove, NCF lamination
Responsibilities
Identify, diagnose and resolve assembly equipment related problems; Coordinate and execute process, equipment and material evaluation / optimization initiatives; Lead / participate in continuous utilization improvement and cost reduction activities; Validate and fan out baseline qualified, including new process, tools and/or materials for new product introduction; Support FDC/RMS/APC/SPC; Manage / audit material suppliers to achieve quality, cost and risk management objectives
Seniority
Senior, hands-on IC
