ENGR II, MANUFACTURING EQUIP; MFG
Core
Lead front end assembly equipment team to ensure maximum uptime and perform advanced troubleshooting on die bond, clip bond, reflow, and inspection lines.
Role type
Senior Equipment Engineer (Manufacturing)
Builds
Semiconductor front-end assembly equipment uptime and reliability
Domain
Semiconductor manufacturing / Front-end assembly
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
ASM equipment operation and troubleshooting, shift team leadership, root cause analysis (8D, FMEA, SPC, 5-Why, Fishbone), OEE monitoring, SOP development
Preferred skills
Experience with die bond, clip bond, reflow, and AOI systems
Technologies
ASM AD838, AD8312PLUS, DA D510, ALPHASAM, AD830CB, AD830PLUS, BESTEM-C310, RO830, RO832, BOCS-6, PINK VADU, ASM DEK, CREST, PENTAMASTER AOI
Responsibilities
Lead and mentor shift technicians to adhere to maintenance schedules and production KPIs; Conduct deep-dive root cause analysis for chronic machine issues; Oversee corrective and preventive maintenance for die attach, clip bond, reflow, oven, and AOI equipment; Monitor Overall Equipment Effectiveness (OEE), uptime, and production time; Establish and update Standard Operating Procedures (SOP) and technical training materials
Seniority
Senior, hands-on IC