Microelectronic Packaging Technical Lead Project Engineer
Core
Lead project coordination and management for microelectronic packaging teams to support the development and delivery of processor packaging solutions, including 3D advanced packaging.
Role type
Senior IC project lead (microelectronic packaging)
Builds
Processor packaging solutions (3D advanced packaging) for Boeing Defense, Space & Security
Domain
Defense, Aerospace, Microelectronics
Deliverable
production ML models | product features | infrastructure
Required skills
Project coordination, team leadership, trade studies, supplier management, risk management, resource planning, performance monitoring, project integration
Preferred skills
Technical project development from concept to production, MS Teams, MS Project
Technologies
3D advanced packaging, ARM-based SoC
Responsibilities
Lead project coordination and management for microelectronic packaging teams; Collaborate with cross-functional teams (design, test, firmware, supplier management); Lead project execution including statement of work management and performance metrics; Coordinate trade studies and source selection; Manage risks, issues, and opportunities; Plan and coordinate resources; Monitor results against baseline plan for cost and schedule.
Seniority
Senior, hands-on IC
