IC Packaging Engineer
Core
Develop sophisticated IC substrates and complex ASIC packages for NVIDIA Networking Business Unit products, ensuring reliability, performance, and manufacturability.
Role type
IC Packaging Engineer
Builds
Cutting-edge microelectronics packaging solutions for networking products
Domain
Semiconductor manufacturing and microelectronics packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Mechanical/Material Engineering background, DFM knowledge, tooling design, material properties, metrology tools, 2D/3D CAD (ArtiosCAD, NX/SolidWorks/Creo), yield improvement planning, cross-functional project leadership
Preferred skills
FEA mechanical simulation, manufacturing statistics tools, semiconductor manufacturing process background
Technologies
ArtiosCAD, NX, SolidWorks, Creo
Responsibilities
Lead development of microelectronics packaging, review manufacturability readiness at milestones, collaborate with vendors on challenging packaging solutions, lead task forces for failure analysis and reliability issues, monitor production KPIs and define Yield Improvement Plans, lead process change reviews and technical reviews
Seniority
Mid-level, hands-on IC
