CareerPlan

Senior Mixed Signal Design Engineer

US, CA, Santa ClaraFull-time$168k–$265k2026-03-04 → 2026-11-11
Based in United States

Core

Designing high-speed memory I/O interfaces (LPDDR, DDR, GDDR, HBM) and SerDes circuits in deep submicron CMOS FinFET processes.

Role type

Senior IC mixed-signal/analog circuit design engineer

Builds

High-speed memory interface chips and SerDes components

Domain

Semiconductor / High-speed digital memory and I/O

Required skills

High-speed memory interface design (LPDDR, DDR, GDDR, HBM), SerDes design, deep submicron CMOS FinFET process knowledge, system-level timing budgeting and analysis, ESD and Latch-Up mitigation, Cadence custom design tools, circuit simulation (Hspice, XA, FineSim, Spectre), layout development, package substrate and board design, power delivery design

Preferred skills

Verilog, Nanotime, Matlab, Lab test and measurement equipment

Technologies

Cadence, Hspice, XA, FineSim, Spectre, LPDDR, DDR, GDDR, HBM, FinFET

Responsibilities

Develop mixed-signal/analog circuits for high-speed memory I/O interfaces, solve circuit development challenges in deep submicron CMOS FinFET processes, take designs through productization, optimize designs with multi-functional teams, lead layout development and ensure compliance with ESD/Latch-Up and reliability rules

Seniority

Senior, hands-on IC