Process Integration Engineer, APTD
Core
Develop and integrate advanced semiconductor process flows for next-generation memory solutions (HBM, DRAM, NAND) to balance performance, yield, reliability, and manufacturability.
Role type
Senior IC Process Integration Engineer (Semiconductor)
Builds
Scalable manufacturing solutions for advanced memory technologies
Domain
Semiconductor manufacturing / Memory technology
Required skills
Process integration, experiment design (DoE), statistical analysis (JMP), root-cause investigation, metrology/defect data analysis, technology qualification, manufacturing transfer
Preferred skills
Advanced packaging (wafer-level, fan-out, 2.5D/3D, TSV, bonding, chiplet), yield/reliability modeling, AI/ML tools for engineering workflows
Technologies
JMP, statistical analysis tools, metrology equipment, defect analysis tools
Responsibilities
Lead process integration projects for new technology programs; Partner with cross-functional teams to solve integration challenges; Design and analyze experiments to improve process performance and yield; Identify yield limiters and drive corrective actions; Develop integration flows balancing performance, cost, and schedule; Support technology qualification and manufacturing transfer across sites
Seniority
Senior, hands-on IC