HBM EQUIPMENT ENGINEER
Core
Evaluate and improve HBM assembly manufacturing processes, equipment, and materials to optimize performance and yield.
Role type
Manufacturing Equipment Engineer (HBM)
Builds
High Bandwidth Memory (HBM) memory and storage products
Domain
Semiconductor manufacturing / Memory technology
Required skills
Thin film dicing, laser groove, NCF lamination, tool installation and setup, FDC analysis, DOE, FMEA, OCAP, 8D, SPC, root cause analysis, equipment design, supplier management
Preferred skills
Tool signal interpretation (SVID, CEID, ECID), AI-enabled tools adoption, cost-saving material evaluation
Technologies
SVID, CEID, ECID, FDC, DOE, FMEA, OCAP, 8D, SPC (via careerplan.io/jobs/JR113652-1-hbm-equipment-engineer-at-micron)
Responsibilities
Optimize process and equipment variables; identify process variables; perform containment of deviations; determine root cause; implement corrective actions; design equipment components; evaluate future technologies; build supplier relationships; create decision matrices for equipment selection.
Seniority
Mid-level, hands-on IC