SR. HBM Stacking Process Engineer
Core
Identify, diagnose, and resolve assembly process problems for HBM stacking while optimizing yield and cost.
Role type
Senior IC process engineer (HBM assembly)
Builds
High-bandwidth memory (HBM) packages and storage solutions
Domain
Semiconductor manufacturing / Memory and storage
Required skills
Flip chip bonding (FCB), Die bond (DB), Grinding, Design of Experiments (DOE), Yield improvement, UPH enhancement, Material supplier management, SPC/FDC/RMS/APC support, Site-to-site portability (via careerplan.io/jobs/24615898-sr-hbm-stacking-process-engineer-at-micron)
Preferred skills
5+ years in production line or engineering background, Master's degree or above, TOEIC 650+