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SR. HBM EQUIPMENT ENGINEER

Taichung City, Taichung City, Taiwan💼 Full-time🗓 2024-12-26 → 2026-10-07

Core

Oversees installation, modification, upgrade, and maintenance of manufacturing equipment for memory and storage solutions, ensuring uptime and process reliability.

Role type

Senior IC equipment engineer (semiconductor manufacturing)

Builds

High-performance DRAM, NAND, and NOR memory and storage products

Domain

Semiconductor manufacturing / Memory and storage (via careerplan.io/jobs/24630286-sr-hbm-equipment-engineer-at-micron)

Required skills

Equipment installation and maintenance, process optimization, supplier management, audit support, FDC/RMS/APC/SPC support, new product introduction validation, continuous improvement, cost reduction

Preferred skills

AI-assisted tool integration, digital fluency

Technologies

Flip chip, CoWos, Wafer inspect, Wafer Molding, Grinding, PSRG, Thinning, Mount, Pillar Reflow, Debond, Steal dicing, laser groove, NCF lamination