HBM EQUIPMENT ENGINEER
Core
Evaluate and improve manufacturing processes, coordinate equipment/material procurement, and qualify/implement new processes for HBM assembly.
Role type
Manufacturing Equipment Engineer (HBM)
Builds
High Bandwidth Memory (HBM) memory and storage solutions
Domain
Semiconductor manufacturing / Memory industry
Required skills
Thin film/dicing tool operation, Tool installation and setup, FDC analysis, DOE/FMEA/OCAP/8D/SPC techniques, Equipment design improvement, Supplier relationship management, Technical research (via careerplan.io/jobs/JR113649-hbm-equipment-engineer-at-micron)
Preferred skills
Tool signal understanding (SVID, CEID, ECID), AI-enabled tools adoption, Cost saving analysis
Technologies
Steal dicing, Laser groove, NCF lamination, SVID, CEID, ECID, FDC
Responsibilities
Optimize process and equipment variables, Identify process variables, Perform containment of deviations, Determine root cause, Implement corrective action, Design equipment components, Evaluate future technologies, Build supplier relationships, Create decision matrices for selection
Seniority
Mid-level, hands-on IC