CareerPlanSign in

Senior or Staff HBM PYE Product Development Failure Analysis Engineer

Boise, ID - Main Site💼 Full-time🗓 2026-09-02 → 2026-09-26

Core

Senior/Staff Product Development Failure Analysis Engineer focusing on High Bandwidth Memory (HBM) product reliability, component failure analysis, and enabling rapid production ramp for next-generation HBM devices.

Role type

Senior/Staff IC Product Development Failure Analysis Engineer (HBM)

Builds

Next-generation High Bandwidth Memory (HBM) devices for mass production

Domain

Semiconductor industry, Memory and Storage solutions

Deliverable

production ML models | product features

Required skills

Electrical failure analysis, Statistical failure analysis, Electrical characterization, Physical characterization, Data analysis, AI tool usage (Claude, Copilot), JMP statistical software, Process defect resolution, Test flow marginality analysis

Preferred skills

VLSI knowledge, Device physics, Semiconductor processes, Python, Statistics, Advanced AI tool application for failure analysis

Technologies

JMP, Claude, Copilot, Python

Responsibilities

Perform electrical and statistical failure analysis to understand failure mechanisms; Identify causes of component failures through data analysis; Work with partner engineering teams to resolve fabrication and assembly process defects; Use AI tools and statistical tools for detailed data analysis to improve component performance

Seniority

Senior/Staff, hands-on IC

Sourced via workday · Listed on CareerPlan, which tracks 70,000+ jobs from 20+ sources.