Product Yield Enhancement (PYE) Engineer
Core
Improving yields of next-generation memory products by identifying and eliminating yield-limiting defects through electrical and physical failure analysis.
Role type
Product Yield Enhancement (PYE) Electrical Failure Analysis (EFA) Engineer
Builds
Next-generation memory products (DRAM, NAND, HBM)
Domain
Semiconductor manufacturing / Memory technology
Deliverable
Production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Electrical Failure Analysis (EFA), Fault Isolation, Emission Microscopy, Laser-based methods (OBIRCH/TIVA), EOTPR, Physical Failure Analysis (PFA), De-processing techniques (FIB, cross-section, delayering), CMOS fabrication knowledge, Package assembly flows, Data extraction from fab/probe/backend systems, Layout and schematic interpretation
Preferred skills
Photon emission analysis, Laser voltage probing (LVP), Thermal laser stimulation, Reliability failure mode analysis (electromigration, TDDB, HCI), Complex fail signature modeling, Data analysis scripting (Python, JMP, MATLAB), Cross-functional collaboration
Technologies
EOTPR, FIB, OBIRCH, TIVA, LVP, JMP, MATLAB, Python
Responsibilities
Perform Electrical Failure Analysis and Fault Isolation using emission microscopy, laser techniques, EOTPR, and PFA/de-processing methods; Characterize and model backend test, internal qualification, and RMA fail signatures using layout, schematic, and data analysis tools; Apply in-depth knowledge of CMOS fabrication processes and package assembly flows to identify process- and assembly-related defects, root causes, and downstream effects; Evaluate reliability concerns and delayed breakdown failure mechanisms across test insertions; Perform fab, probe, and backend data extractions to provide supplemental data supporting failure analysis conclusions; Generate organized and timely failure analysis reports with clearly communicated causes, effects, and recommended actions; Present and coordinate findings cross-functionally with Management, Product, Process, Assembly, and Global Quality teams
Seniority
Mid-level IC (2+ years experience required)
