Principal Product Yield Analysis Engineer
Core
Resolve complex test yield and reliability issues for next-generation memory devices (HBM) from design to mass production using electrical, physical, and optical failure analysis.
Role type
Principal Product Yield Analysis Engineer (FA)
Builds
High-yield, reliable memory and storage solutions for the semiconductor industry
Domain
Semiconductor manufacturing / Memory and storage
Required skills
electrical failure analysis, physical failure analysis, optical fault isolation, EDA tools, fab data analysis, root cause analysis, cross-functional coordination, technical presentation, mentoring
Preferred skills
DRAM/HBM product experience, 3D-integration/packaging root cause analysis, sub-10nm process nodes, advanced programming (Java, C++, Python, R), ML/AI for failure analysis
Technologies
ESDA, layout/net tracing, image analyzers, photon emission, optical probing, microprobing, EDA tools
Responsibilities
Perform electrical and physical failure analysis and optical fault isolation; leverage EDA tools for circuit understanding and failure signature analysis; dissect fab and probe data to monitor yields and correlate with reliability data; lead weekly teleconferences to present findings and recommend corrective actions; mentor remote FA teams on advanced methods and provide 1st silicon support
Seniority
Principal, hands-on IC with mentorship