Principal Product Yield Analysis Engineer
Core
Resolve complex test yield and reliability issues for next-generation memory devices (HBM) from design to mass production ramp-up.
Role type
Principal Product Yield Analysis Engineer (IC)
Builds
Next-generation memory and storage solutions (HBM) for the semiconductor industry
Domain
Semiconductor manufacturing, memory technology, failure analysis
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
electrical failure analysis, physical failure analysis, optical fault isolation, EDA tools, fab data analysis, root cause analysis, cross-functional coordination, technical presentation, mentoring
Preferred skills
DRAM/HBM product experience, 3D-integration/packaging root cause analysis, sub-10nm process nodes, optical engineering, ML/AI applied to failure analysis, advanced programming (Java, C++, Python, R)
Technologies
ESDA, layout/net tracing, advanced image analyzers, photon emission, optical probing, microprobing, hybrid/2.5D/3D EDA tools
Responsibilities
Perform electrical and physical failure analysis and optical fault isolation to replicate probe failures and determine root cause; Leverage EDA tools for circuit understanding, timing characterization, and failure signature analysis; Dissect fab and probe data using ESDA, layout/net tracing, and image analyzers to monitor yields and correlate data; Lead weekly teleconferences to present findings and recommend corrective actions; Mentor remote FA teams on advanced methods and provide 1st silicon support for new products
Seniority
Principal, hands-on IC with mentorship