Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)
Core
Lead Media Health Manufacturing and test flow development for next-generation High Bandwidth Memory (HBM) products, focusing on DRAM, Interface, and Stacked Die architectures.
Role type
Principal Engineer, HBM Product System Engineering (Media Health Manufacturing)
Builds
Next-generation HBM products for data center and AI applications
Domain
Semiconductor manufacturing, High Bandwidth Memory (HBM), DRAM, Interface, and Stacked Die
Required skills
Root cause analysis, circuit debug, test coverage optimization, DFT strategy, yield improvement, project management, cross-functional collaboration, statistics and data analysis, scripting, CAD tools, Verilog simulations
Preferred skills
Product Engineering experience, leadership of high-performing teams, innovation in manufacturing test flows, leveraging AI tools for productivity
Technologies
CAD tools, Verilog, HBM architectures, DRAM, Interface die, Stacked product
Responsibilities
Lead manufacturing test flow development and validation; improve device/stacked yield through circuit debug and test strategy innovation; reduce test time and resolve yield-related issues; support new product design verification and characterization; mentor team members; make technical decisions on risk analysis and project prioritization; collaborate with Fab, Design, and Technology Development teams
Seniority
Principal, hands-on IC with leadership responsibilities