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Senior Manager, HBM Customer Integration Technical Leader

Boise, ID - Main Site💼 Full-time🗓 2026-09-02 → 2026-09-25

Core

Senior technical leader bridging external customers and internal engineering teams to integrate advanced HBM (High Bandwidth Memory) products, focusing on architecture, signal integrity, thermal solutions, and packaging strategies.

Role type

Senior Manager, HBM Customer Integration Technical Leader

Builds

Advanced HBM products for customers requiring high-performance memory and storage solutions

Domain

Semiconductor industry, High Bandwidth Memory (HBM), System Integration

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

HBM architecture expertise, signal integrity analysis, thermal solution design, packaging strategies, root-cause analysis, system-level requirement interpretation, cross-functional engineering leadership

Preferred skills

10+ years in semiconductor product engineering, system integration, or customer-facing technical roles, experience with HBM manufacturing processes, ability to map customer requirements to internal design capabilities

Technologies

HBM, Front-End process engineering, Back-End process engineering, AI systems for automation

Responsibilities

Translate customer technical needs into actionable requirements for internal design and manufacturing teams, provide technical mentorship on HBM architecture and packaging, lead root-cause analysis for integration issues, support design reviews and failure analysis, drive adoption of engineering capabilities powered by intelligent technology

Seniority

Senior, hands-on IC with management responsibilities

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