Engineer – 3D NAND Process Integration
Core
Design, develop, integrate, and implement process solutions to improve next-generation 3D NAND product yield and quality with competitive cost and performance.
Role type
Senior IC process integration engineer (3D NAND)
Builds
Next-generation 3D NAND memory products
Domain
Semiconductor manufacturing / Non-volatile memory
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Process integration optimization, data analysis, problem-solving, cross-functional team leadership, technology transfer, yield improvement, manufacturing qualification, AI tool integration
Preferred skills
JMP, Tableau, holistic end-to-end PI module understanding, structural & electrical fail mechanisms, NAND process flow, process-device interaction, R&D product life cycle
Technologies
JMP, Tableau
Responsibilities
Identify and quantify module deficiencies and technology gaps; Develop or redefine CSPEC criteria for optimal product performance; Coordinate manufacturing site activities for experiments and conversions; Evaluate and implement new integration schemes for alpha and derivative part types; Lead quarterly yield summits and monthly program reviews; Assist in technology transfer from R&D to manufacturing and support ramp-up; Integrate AI-assisted tools to improve efficiency and quality
Seniority
Senior, hands-on IC