CareerPlan

Front End Central Product Integration (FE cPIE) MTS (FE)

Boise, Idaho, United States of AmericaFull-time2026-05-14 → 2026-10-20

Core

Lead multi-functional efforts to improve structural uniformity, process integration, and product performance across critical semiconductor modules.

Role type

Senior Process Integration Engineer (Semiconductor Manufacturing)

Builds

Semiconductor memory and storage solutions (DRAM, NAND)

Domain

Semiconductor manufacturing / Process Engineering

Deliverable

production ML models

Required skills

Semiconductor process flows, physics-based modeling, data analysis, root cause analysis, inline monitoring strategies, DRAM/NAND device structures

Preferred skills

Cross-functional project leadership, model-based problem solving, process control strategy development, global team collaboration, Agentic AI workflows

Technologies

Semiconductor manufacturing tools, data analysis platforms, inline monitoring systems

Responsibilities

Lead process integration strategies to improve yield and reliability; Develop physics-based solutions for structural uniformity; Partner with engineering and supplier teams to optimize process interactions; Apply model-based root cause analysis for manufacturing issues; Define and improve inline monitoring strategies; Drive early integration strategies and best-known methods (BKMs); Lead global projects to standardize practices across manufacturing sites.

Seniority

Senior, hands-on IC