Principal/Staff Engineer, Process Integration, NTI NAND
Core
Lead the development and operation of 3D NAND semiconductor circuits, defining specifications, optimizing performance, and transferring technology from R&D to manufacturing.
Role type
Principal/Staff Engineer, Process Integration (Semiconductor)
Builds
3D NAND memory devices and storage solutions
Domain
Semiconductor manufacturing, Non-volatile memory (NAND)
Required skills
Wafer Fabrication Process Development, Process Integration, NAND process flow, Structural & electrical fail mechanisms, R&D to manufacturing transfer, Data analysis, Scripting/Programming (Python, SolidWorks, Tableau, Power BI)
Preferred skills
AI tool integration, Patent generation, Cross-functional coordination
Technologies
Python, SolidWorks, Tableau, Power BI
Responsibilities
Define structural specifications and process requirements for assigned modules; Identify and resolve structure, electrical, and reliability issues using a model-based approach; Optimize manufacturability assessments and parametric verification; Analyze materials physically and electrically to select new materials for production; Build and analyze device and process experiments; Lead a development team of process engineers; Coordinate activities across cross-functional teams; Support technology transfer from R&D to high-volume manufacturing.
Seniority
Principal/Staff, hands-on IC with leadership