Front End Central Product Integration (FE cPIE) MTS (FE)
Core
Lead process integration (PI) structural uniformity and cross-loop integration for critical modules in semiconductor fabrication to resolve yield, quality, and reliability gaps.
Role type
Senior IC process integration engineer (semiconductor manufacturing)
Builds
High-yield DRAM and NAND memory chips
Domain
Semiconductor manufacturing (Front End)
Required skills
Semiconductor fabrication process flows, DRAM/NAND operation and structure, model-based root cause analysis, data-driven decision making, inline monitoring metrics, business process re-engineering
Preferred skills
Node-over-node shift-left integration, global project leadership, cross-module collaboration
Technologies
CD, film loss, mass delta, defectivity, edge/periphery metrics, transport, reaction kinetics, pattern density, geometry-dependent effects
Responsibilities
Lead process integration structural uniformity and cross-loop integration for critical modules; Develop and apply model-based root cause analysis frameworks; Own and advance product integration programs and loop-level domain expertise; Drive worldwide technical alignment and execution excellence
Seniority
Senior, hands-on IC