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Dry Etch Process Manager

Boise, ID - Main Site, US💼 Full-time🗓 2026-08-06 → 2026-09-26

Core

Lead the hiring, training, and startup of the Dry Etch process team for a new high-volume manufacturing (HVM) memory facility in Boise, ID.

Role type

Senior IC Process and Equipment Engineering Manager (Dry Etch)

Builds

New HVM memory fabrication capacity

Domain

Semiconductor manufacturing (Memory/Dry Etch)

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Dry Etch process expertise, team leadership, capacity planning, process qualification, cross-functional partnership, strategic vision setting, succession planning

Preferred skills

Data analysis, problem-solving, troubleshooting, Agentic AI workflow development

Technologies

Dry Etch tools, HVM manufacturing systems

Responsibilities

Lead hiring and training of new Dry Etch engineers; partner with global DRAM teams to startup the new HVM facility; collaborate with Manufacturing and Industrial Engineering to validate capacity planning; support process qualification on new tools; serve as a technical resource for global counterparts; ensure succession plans for key positions

Seniority

Senior, hands-on IC with leadership mandate

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