Director, Process Engineer – Dry Etch
Core
Lead dry etch process engineering efforts to drive technology development, process capability, and manufacturability across advanced CMOS technologies for Intel's foundry service.
Role type
Director, Process Engineer (Dry Etch)
Builds
Advanced CMOS technology nodes for Intel foundry customers
Domain
Semiconductor manufacturing / Dry Etch / Plasma Processing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
dry etch process development, plasma chemistry, etch mechanisms, profile control, selectivity, microloading, CD control, chamber matching, defect reduction, process integration, metrology interpretation, recipe optimization, tool troubleshooting, HVM enablement, supplier engagement
Preferred skills
Doctoral degree, advanced logic technologies (Gate-All-Around), process transfer experience, ramp readiness, excursion response, tool qualification
Technologies
Plasma etch, Reactive Ion Etch (RIE), Atomic Layer Etch (ALE), conductor etch, dielectric etch, thermal etch, post-etch treatment, clean processes
Responsibilities
Define and execute process experiments to resolve tool and process issues; Partner with cross-functional teams and suppliers to meet technology roadmap requirements; Drive improvements in yield, performance, defectivity, uniformity, and cost; Support process development, transfer, optimization, and sustaining activities for multiple technology nodes; Document process learning, best known methods, and control plans.
Seniority
Director, strategic leadership with hands-on technical execution