PDE HBM NPI Assembly Engineer
Core
Identify, diagnose, and resolve assembly process problems for new product introduction (NPI) while optimizing processes, equipment, and materials.
Role type
NPI Assembly Engineer
Builds
New memory and storage product assembly lines and processes
Domain
Semiconductor manufacturing (DRAM, NAND, NOR)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Assembly process troubleshooting, Process optimization, Yield improvement, Cost reduction, Supplier management, Audit support, SPC/FDC/RMS/APC support, Site-to-site portability
Preferred skills
AI capabilities or AI-empowered work methods
Technologies
SPC, FDC, RMS, APC
Responsibilities
Identify, diagnose, and resolve assembly process related problems; Coordinate and execute process, equipment, and material evaluation/optimization initiatives; Lead/participate in continuous yield improvement and cost reduction activities; Validate and fan out new process baseline qualified including new process, tools, and/or materials for new product introduction; Support SPC/FDC/RMS/APC; Manage/audit material suppliers to achieve quality, cost, and risk management objectives; Support internal and external audits
Seniority
Entry-level (Fresh graduates or <1 year experience)
