Entry Level for ONSC Process Engineering (Master)
Core
Lead new product introduction (NPI) from engineering build through qualification and initial manufacturing release for semiconductor power modules and IC packages.
Role type
Entry-level Process Engineer (NPI)
Builds
Semiconductor power modules, discrete devices, IC packages, and advanced packaging products
Domain
Semiconductor manufacturing and assembly
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DOE, SPC, FMEA, control plan development, 8D problem solving, failure analysis, process capability analysis, yield analysis, engineering report writing, statistical data analysis
Preferred skills
Semiconductor assembly and packaging process flow knowledge, automotive qualification experience, high-reliability manufacturing environment experience, Chinese language communication
Technologies
Excel, JMP, Minitab, Power BI
Responsibilities
Execute NPI and EBR from feasibility to initial manufacturing release, coordinate cross-functional technical activities, facilitate design and production readiness reviews, define and execute process characterization and validation, monitor build performance and drive issue containment, prepare qualification and release documentation, support management reviews with technical status, complete handover to sustaining engineering
Seniority
Entry Level