Director, Package Quality and Reliability
Core
Leading execution and continuous improvement of package reliability, qualification, and failure analysis across new product introductions and high-volume manufacturing for diverse application segments including mobile, automotive, data center, and AI/HPC.
Role type
Director, Package Quality & Reliability Engineering
Builds
Robust package quality and reliability performance enabling successful product ramps
Domain
Semiconductor packaging and reliability engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging technologies and materials, Package reliability test methodologies (temperature cycling, HAST, MSL/preconditioning), Failure analysis techniques (cross-sectioning, SAM, X-ray, SEM/EDX), Chip-to-package interaction and thermo-mechanical stress analysis, Qualification processes and risk assessment, High-volume manufacturing environment experience, People management and technical leadership
Preferred skills
Memory products experience (DRAM, NAND, HBM), Advanced packaging technologies (system-in-package, hybrid bonding), Automotive or AI/HPC reliability requirements, Predictive reliability analytics, Digital quality systems, Supplier and OSAT interaction
Technologies
AI-enabled tools for data analysis and operational improvement, Digital and predictive approaches for testing and monitoring
Responsibilities
Lead execution of package reliability qualification for new product introductions and ongoing reliability monitoring in high-volume manufacturing, Identify and resolve key reliability risks including chip-to-package interaction and material-related failure mechanisms, Drive improvements in reliability test coverage and methodologies aligned to end-use application requirements, Partner with Package Development Engineering to integrate Design for Reliability and Design for Manufacturability into package design, Lead and develop a team of engineers focused on package reliability, qualification, and failure analysis, Provide technical input and recommendations for risk assessment including new package qualifications and process changes
Seniority
Director, technical leadership and people management
