Co-Packaged Optics (CPO) Reliability Sr. Staff/Principal Engineer
Core
Lead reliability, qualification, and robustness assessment for next-generation co-packaged photonic and electronic systems, focusing on high-speed silicon switch ASICs and optical transport.
Role type
Sr. Staff/Principal Reliability Engineer (CPO)
Builds
Co-packaged optical and electronic systems for data centers
Domain
Semiconductor packaging, photonics, data center infrastructure
Deliverable
production ML models | product features | infrastructure
Required skills
Accelerated testing methodology definition, thermal/mechanical interface evaluation, Design for Reliability (DfR), FMEA/DFMEA execution, physics-of-failure modeling, statistical analysis (JMP), root-cause failure analysis, supply chain quality audit
Preferred skills
GR-468 (Telcordia) and JEDEC standards expertise, 2.5D/3D packaging knowledge, III-V laser source integration experience
Technologies
Silicon switches, PICs, OSAT, contract manufacturers, foundry suppliers, JMP
Responsibilities
Define and execute qualification plans for CPO architecture; characterize and model reliability failure modes in high-density packaging; partner with design teams on DfR and risk mitigation; develop reliability lifetime modeling frameworks; analyze ALT data and calculate FIT/MTBF metrics; own root-cause failure analysis for qualification and field returns; collaborate with supply chain partners to standardize test methodologies
Seniority
Sr. Staff/Principal, hands-on IC with strategic qualification leadership
