HBM 3D Power Delivery Network (PDN) Engineer
Core
Design, analyze, and optimize power delivery networks (PDN) for next-generation HBM products to ensure power integrity, reliability, and manufacturability.
Role type
Senior IC HBM Power Delivery Network (PDN) Engineer
Builds
SoC-level and HBM-cube-level power delivery networks for high-performance memory solutions
Domain
Semiconductor / High-Performance Computing / 3D Heterogeneous Integration
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
EM/IR analysis, Spice-based simulation, 3D PDN modeling, IR drop analysis, electromigration analysis, dynamic voltage droop analysis, physical design flow knowledge, RTL-to-GDSII design flow, debugging complex issues
Preferred skills
HBM/DRAM/SoC design experience, 3DIC power delivery challenges, die-package-system co-design, advanced packaging (2.5D/3D), transient/vector-based power analysis, JEDEC standards knowledge, mentoring
Technologies
Cadence RedHawk, Ansys Totem
Responsibilities
Design SoC and HBM-cube power grids and routing strategies; Perform EM/IR analysis and optimization; Collaborate on floorplanning and placement; Drive power integrity closure across multi-corner scenarios; Co-optimize die-package-system interactions; Develop and validate power models; Support signoff activities; Debug PDN issues pre- and post-silicon; Improve PDN methodologies via automation
Seniority
Senior, hands-on IC
