High Volume Manufacturing Engineer (Staff/Principal)
Core
Guide manufacturing flow across ATE and SLT for OSATs, driving industry-leading products from pre-si readiness through post-si bring-up and high-volume manufacturing (HVM) for 2.5D/3D IC and sub-3nm nodes.
Role type
Staff/Principal High Volume Manufacturing Engineer (Silicon Bring-up & Product Engineering)
Builds
Production silicon products (CPU/GPU/SoC) for OSAT partners
Domain
Semiconductor manufacturing, IC design, and advanced packaging (2.5D/3D IC)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CPU/SOC/GPU silicon bring-up, manufacturing test, yield improvement, silicon characterization, reliability qualification, structural/functional test concepts, DFT/SW diagnostics, device physics, foundry/assembly process knowledge, IC data tools (Silicon.da/Optimal+/JMP)
Preferred skills
SOC Design, yield analysis, software scripting
Technologies
ATE, SLT, Silicon.da, Optimal+, JMP
Responsibilities
Align multi-functionally with design, packaging, software, validation, and quality teams; enhance yield and characterization methodologies using integrated sensor frameworks; own post-silicon manufacturing test flow and electrical failure analysis; drive execution of manufacturing flows at OSATs during HVM.
Seniority
Principal, hands-on IC engineering with strategic cross-team influence