PDE PIE (Package Integration Engineering) Senior Engineer/Engineer
Core
Lead New Product Introduction (NPI) activities to transfer semiconductor packages from development to high-volume manufacturing, ensuring yield and quality targets are met.
Role type
Senior IC Package Integration Engineer
Builds
High-volume memory and storage packages (DRAM, NAND, NOR) for mobile, automotive, data center, and AI applications
Domain
Semiconductor manufacturing, backend packaging, and new product introduction
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging knowledge, backend engineering process expertise, component test and module manufacturing, package structures (BGA, PoP), statistical analysis, JMP proficiency, data-driven decision making
Preferred skills
AI-assisted tool usage for root cause screening and DOE design
Technologies
JMP, BGA, PoP
Responsibilities
Lead NPI activities as Product Owner, drive NPI Phase Gate Reviews, coordinate new product start-up and first pass qualification, monitor product yield trends and reliability, own the entire product life cycle from NPI to EOL, collaborate with process and equipment owners to develop new technology capabilities
Seniority
Senior, hands-on IC
