Principal Engineer, FE OCT CPEE ADT BOND
Core
Lead the startup, development, optimization, and control of wafer-level bonding processes (hybrid, fusion, temporary) to drive yield improvement and cost reduction in semiconductor manufacturing.
Role type
Principal Engineer, Semiconductor Process & Equipment Engineering
Builds
Wafer-to-wafer bonding solutions for advanced packaging (HBM, TSV) and high-performance memory/storage products
Domain
Semiconductor manufacturing / Advanced packaging / Materials Science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor bonding process expertise (hybrid, fusion), Root cause analysis (DOE, FMEA, 8D, SPC), Equipment qualification (EVG, TEL, Disco), Yield enhancement strategies, Cross-functional project management
Preferred skills
Advanced packaging technologies (HBM, TSV), Cu plating and CMP interaction knowledge, Statistical modeling proficiency
Technologies
EVG, TEL, Disco platforms, SPC tools, DOE/FMEA/8D methodologies
Responsibilities
Develop and qualify bonding process technologies and recipes; Lead yield enhancement initiatives through systematic root cause analysis; Collaborate with equipment engineering to optimize grinding and trimming tools; Support technology transfer and process integration across global sites; Diagnose and resolve manufacturing line issues impacting bonding yield; Lead new process and baseline qualifications with risk mitigation frameworks
Seniority
Senior, hands-on IC with strategic process ownership
