Process Engineering Wirebond
Core
Optimizes, sustains, and develops ultrasonic wire bonding processes to enhance yield, quality, and cost-efficiency in semiconductor manufacturing.
Role type
Process Engineering Wirebond
Builds
Semiconductor manufacturing processes and products
Domain
Semiconductor manufacturing / Wire bonding
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Ultrasonic wire bonding techniques, Materials science (Au, Cu, Al), Equipment operation (K&S, ASM, Shinkawa, Orthodyne), Data analysis (Pareto, SPC), Root-cause analysis, Process documentation (SOP, FMEA, Control Plans), NPI coordination
Preferred skills
None stated
Technologies
K&S, ASM, Shinkawa, Orthodyne
Responsibilities
Define and document wire bonding recipes and parameters, Analyze yield trends and implement corrective actions, Coordinate setup and validation of new equipment and materials, Provide technical troubleshooting support to production teams, Create and update process specifications and compliance documents, Coach junior engineers and technicians
Seniority
Mid-level, hands-on IC