SMTS WLT Technical
Core
Lead next-generation advanced packaging technologies and drive innovations in lithography, cleaning, deposition, and bonding processes.
Role type
Technical Lead, Advanced Packaging
Builds
Advanced packaging solutions for memory and storage devices
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | infrastructure
Required skills
Advanced packaging technologies, Lithography, Cleaning processes, Deposition processes, Bonding processes, Project lifecycle management, Technical documentation, Cross-functional collaboration, Problem-solving
Preferred skills
Advanced degrees in Engineering
Technologies
Lithography tools, Cleaning systems, Deposition equipment, Bonding machinery
Responsibilities
Lead and drive technical projects in advanced packaging, Deliver technical insight for project implementation, Own project lifecycle from concept to implementation, Collaborate with cross-functional teams, Develop and maintain technical documentation, Stay updated with industry trends
Seniority
Lead, hands-on technical leadership