Field Application NTP Project lead Nagasaki
Core
Local project lead and application engineer supporting customer node projects, new product introductions, and engineering evaluations for semiconductor lithography systems.
Role type
Senior IC Field Application Engineer / Project Lead
Builds
Semiconductor lithography nodes and advanced packaging solutions for semiconductor manufacturers
Domain
Semiconductor manufacturing / Lithography
Deliverable
client delivery
Required skills
Node transition project management, product evaluation in HVM environments, technical documentation creation, data analysis, troubleshooting, stakeholder coordination, presentation delivery
Preferred skills
Cost of ownership analysis, cross-functional collaboration with Sales/Marketing/Product, proactive issue resolution
Technologies
DUV, YS, VCP, MATLAB, Excel, PowerPoint
Responsibilities
Lead engineering workstreams for node transition projects, introduce and evaluate new ASML products, act as engineering interface to customers, prepare internal and external management reports, provide onsite engineering support including occasional cleanroom work
Seniority
Senior, hands-on IC with project leadership