Digital Failure Analysis Engineer (LFAB)
Core
Conduct digital failure analysis and root cause analysis on failing silicon by integrating test data, DFT observability, and physical analysis to enable corrective actions across yield and product development.
Role type
Digital Failure Analysis Engineer
Builds
Actionable root cause reports and corrective actions for analog and embedded semiconductor products
Domain
Semiconductor manufacturing (300mm, 65nm/45nm/28nm)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Digital circuitry behavior analysis, VLSI silicon debug, ATPG test vector generation, emission microscopy, DFT-enabled observability, yield analysis, cross-functional technical bridging
Preferred skills
DFT and ATPG for SoC/ASIC designs, EDA tool utilization, VLSI familiarity, digital design fundamentals
Technologies
ATPG, DFT, EDA tools, emission microscopy
Responsibilities
Convert failing silicon into actionable root cause using test and characterization data; Perform deep-dive analysis on VLSI designs to understand digital circuitry behavior and failure modes; Act as a technical bridge between Design, Test, and Physical FA teams; Conduct product ownership analysis for yield issues and new product qualification
Seniority
Mid-Senior, hands-on IC
