NTI Physical Failure Analysis Technician
Core
Providing physical failure analysis for next-generation semiconductor memory products to identify failure mechanisms and assist with root cause analysis for yield issues.
Role type
Physical Failure Analysis Technician (Yield Enhancement)
Builds
Next-generation memory processes and nodes for production fab
Domain
Semiconductor manufacturing / Memory storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Delayering devices using wet and dry techniques, Focused Ion Beam (FIB) operation, SEM operation, STEM lamella creation, cross-section analysis, top-down analysis, inline process improvement feedback, root cause isolation, tool maintenance
Preferred skills
Knowledge of semiconductor device physics, fabrication, operation, architecture, and statistics, continuous improvement process (CIP) mindset, creative problem solving
Technologies
Acid hood, polish wheel, wet/dry etch, SEM, dual beam FIB, STEM, TEM, bench testers, emission and laser techniques
Responsibilities
Collaborate with EFA engineering for visual defect identification, innovate ways to improve work efficiency and shorten root cause visualization time, interpret and summarize data for engineers, build and improve new techniques to identify failure mechanisms, test new processes to improve productivity, maintain PFA tools for maximum uptime
Seniority
Entry-level to Mid-level, hands-on IC
