Module Engineering - Day Shift 5 or 7
Core
Develop and optimize assembly processes and equipment for advanced packaging solutions, evaluating silicon and package technologies under simulated field conditions.
Role type
Foundry Packaging Module Engineer
Builds
Next-generation foundry packaging platform technologies
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Statistical Process Control (SPC), Design of Experiments (DOE), mechanical/thermal/materials defect analysis, raw material specification management, process compliance enforcement, DFM oversight, reliability screening techniques
Preferred skills
Semiconductor packaging processes, foundry context experience, technology development environment experience
Technologies
SPC, DOE, thermal cycling equipment, humidity chambers, mechanical stress testing equipment
Responsibilities
Design and develop assembly processes and hardware configurations, calibrate and maintain reliability evaluation equipment, establish raw material specifications for vendors, implement early failure detection techniques, apply SPC and DOE to optimize yields, ensure designs are manufacturable, provide technical consultation on packaging challenges, drive standardization of qualification frameworks
Seniority
Mid-level, hands-on IC