Packaging Module Development Engineer
Core
Develop and integrate next-generation laser and optical process technologies for advanced semiconductor packaging solutions.
Role type
Senior IC packaging process engineer (laser/optical)
Builds
Next-generation semiconductor packaging modules
Domain
Semiconductor manufacturing / Laser and optical processing
Required skills
Laser and optical process development, DOE and statistical analysis, root-cause analysis, equipment qualification, Python/MATLAB/JSL scripting, experimental design
Preferred skills
Laser-material interaction physics, 3D optical profiling, COMSOL/ANSYS simulation, JSL automation, ultrafast pulse dynamics
Technologies
Python, MATLAB, JMP/JSL, LabVIEW, COMSOL, ANSYS, 3D optical profilers, confocal microscopes
Responsibilities
Develop and optimize laser/optical processes for semiconductor packaging, design and execute experiments to drive process improvements, support installation and qualification of new equipment, investigate process issues and implement yield/reliability solutions, collaborate across engineering teams to document technical findings
Seniority
Senior, hands-on IC
