Advanced Packaging Module Development Engineer
Core
Design and develop sophisticated manufacturing processes and equipment solutions for high-volume semiconductor production and next-generation device architectures.
Role type
Senior Process Integration Engineer (Advanced Packaging)
Builds
High-volume manufacturing processes, advanced packaging modules, and next-generation semiconductor devices
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor processing, system controls, opto-mechanics, mechanical systems, robotics, automation systems, vision systems, image processing, Statistical Process Control (SPC), Design of Experiments (DOE), equipment metrology, material selection, parameter optimization
Preferred skills
Python programming, MATLAB, complex manufacturing troubleshooting, packaging process automation, project management, semiconductor device physics
Technologies
Python, MATLAB, robotics, automation systems, vision systems, image processing
Responsibilities
Drive technology development for high-volume manufacturing and future technology nodes; lead design and development of manufacturing processes including material selection and parameter optimization; perform pathfinding activities for future device architectures; recommend modifications to operating equipment to improve production efficiency; partner with suppliers to develop enabling technology elements; perform process technology feasibility studies using simulations and engineering methods; apply SPC and DOE principles for data-informed decisions; leverage robotics and automation systems to advance manufacturing capabilities
Seniority
Senior, hands-on IC
