Packaging Module Equipment Development Engineer
Core
Develop and optimize assembly processes and equipment for next-generation semiconductor packaging solutions to enhance US-based manufacturing efficiency and reliability.
Role type
Senior IC Packaging Module Equipment Development Engineer
Builds
Advanced semiconductor packaging modules and assembly equipment
Domain
Semiconductor manufacturing / Packaging technology
Deliverable
production ML models | product features | infrastructure
Required skills
Statistical Process Control (SPC), Design of Experiments (DOE), equipment qualification, process optimization, manufacturability analysis, technical reporting, problem-solving
Preferred skills
High-volume manufacturing experience, equipment troubleshooting, semiconductor fabrication knowledge, safety and cost-effective design
Technologies
Semiconductor packaging equipment, statistical analysis tools
Responsibilities
Develop and optimize assembly processes and equipment; Apply DOE and SPC to refine processes and specifications; Ensure manufacturability of physical layouts in package designs; Support integration of new materials and architectures into equipment; Innovate techniques to identify equipment health issues; Lead continuous improvement initiatives; Standardize equipment qualification practices.
Seniority
Senior, hands-on IC
