Packaging Module Development Engineer
Core
Design, optimize, and qualify packaging assembly processes and equipment for advanced semiconductor products.
Role type
Entry-level packaging module development engineer
Builds
Semiconductor packaging assembly processes and equipment
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Statistical Process Control (SPC), Design of Experiments (DOE), process development, equipment qualification, data analysis, risk assessment
Preferred skills
Machine vision systems, automated inspection, camera-based measurement, Python, MATLAB, SQL
Technologies
Python, MATLAB, SQL
Responsibilities
Develop and qualify packaging assembly processes and equipment; Lead experimental design and process characterization; Innovate new techniques and materials; Collaborate on cross-functional risk mitigation; Establish material and equipment specifications; Provide technical consultation in development and manufacturing; Document technical findings and process improvements; Drive standardization of manufacturing systems globally
Seniority
Entry-level, hands-on IC
